PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD10L DFN 3x3mm0520Matte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0248
MCP73855T-I/MF |
RFQ for MCP73855T-I/MF |
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| Technical/Catalog Information | MCP73855T-I/MF |
| Vendor | Microchip Technology (VA) |
| Category | Integrated Circuits (ICs) |
| Battery Type | Li-Ion, Li-Pol |
| Function | Charge Management |
| Package / Case | 10-DFN |
| Packaging | Cut Tape (CT) |
| Operating Temperature | -40°C ~ 85°C |
| Voltage - Supply | 4.5 V ~ 5.5 V |
| Drawing Number | * |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MCP73855T I MF MCP73855TIMF MCP73855T I MFCT ND MCP73855TIMFCTND MCP73855T-I/MFCT |
| Product | Manufacturers | Pack | D/C | ||||||||
| MCP73855T-I/MF | - | - | - |